The Electroless Nickel and Electroless Palladium Immersion Gold Process,ENEPIG for PCB Plating

Introduction
The Electroless Nickel and Electroless Palladium Immersion Gold process is applied in PCB(ENEPIG) , with process feature of no skip plating,

inquiry

Details

Introduction

The Electroless Nickel and Electroless Palladium Immersion Gold process is applied in PCB(ENEPIG) , with process feature of no skip plating, no black pads, moderated phosphorous content and strong corrosion resistance. The plating coating also has excellent solderability and bondability, can take the place of the ENIG and ENIG+OSP process.

 

Application

The Electroless Nickel and Electroless Palladium Immersion Gold process(ENEPIG) can be used in the plating process of printed circuit board and replace the process of ENIG and ENIG+OSP.

 

Application examples


Printed-Circuit-Boar-Flexible-Printing-Circuit-Plating.jpg


Representative Process

IMT-6100 Electroless Nickel Plating Process

IMT-6065 Electroless Palladium Plating Process

IMT-6500 Electroless Gold Plating Process

ͼƬ118(001).jpg

ͼƬ119(001).jpg

ͼƬ120(001).jpg

ͼƬ121(001).jpg

ͼƬ122(001).jpg

ͼƬ123(001).jpg

ͼƬ124(001).jpg

ͼƬ125(001).jpg

ͼƬ126(001).jpg

ͼƬ127(001).jpg

ͼƬ128(001).jpg

ͼƬ129(001).jpg

ͼƬ130(001).jpg

ͼƬ131(001).jpg

ͼƬ132(001).jpg

ͼƬ133(001).jpg

ͼƬ134(001).jpg

Feedback

Subscribe to our email list
Sign up with your name and email to get the latest proway updates, exclusive access to promotions, sales events, pre-order sales & more!
Connect with Highnic
Share our products, updates, news and events with your friends.
QR Code
  • About Highnic
  • Technology
  • Product
  • Exhibition
  • News
  • Contact
  • Copyright © Highnic Group All Rights Reserved.