Super leveling acid copper plating brightener

Super leveling acid copper plating brightener

Super-leveling acid copper plating brighteners are three-component plating additives with excellent brightening effect and leveling strength on workpiece. Final product can generate a beautiful bright surface after plating with our product. Model Name: Super-leveling Components: Make up agent SUPER-MU, Brightener SUPER-A, Brightener SUPER-B

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Super-leveling acid copper plating brightener

Model Name: Super-leveling


Super-leveling acid copper plating brighteners are three-component plating additives with excellent brightening effect and leveling strength on workpiece. Final product can generate a beautiful bright surface after plating with our product.


Product Features:

1.It has excellent brightening and leveling strength.

2.It has good covering strength, and the leveling in LCD area is good.

3.The bath solution is stable and is easy to control.

4.The plating layer has well flexibility, corrosion resistance, and seldom brings pinhole or hard spots.

5.It can be used in acid copper plating of plastic plating, lighting, bathroom facilities, hardware, etc.


Components:

Make up agent SUPER-MU, Brightener SUPER-A, Brightener SUPER-B


Effect of different copper plating additives:

Making up agent SUPER-MU:hard spot grows easily at insufficient content and loose and stripy coating appears at high and middle potential zone in a worse case;fog coating appears at low potential zone when it is too much.

Brightener SUPER-A:coating leveling decreases at whole current density range if it’s too low while coating leveling decreases suddenly and forms a significant boundary at low potential zone when it’s too much.

Brightener SUPER-B:the coating is easily burning at insufficient content while too much could cause fog at low potential zone.

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Knowledge of copper plating

Copper plating is the process of electrolytically forming a layer of copper on the surface of an item. It takes place in an electrolytic cell where electrolysis which uses direct electric current to dissolve a copper rod and transport the copper ions to the item. 

Copper plating material surfaces presents a number of advantages to substrates. The primary reason for copper plating is to improve the conductivity of a substrate, copper is 100% conductive. As a soft metal, copper is also malleable and so has the inherent flexibility to maintain adhesion even if a substrate is subject to being bent and manipulated post plating. When electroplated copper also provides a smooth, even coverage and so provides an excellent base for additional coating or plating processes. Corrosion resistance is another advantage to copper. Although copper is not as effective at resisting corrosion as nickel and so is commonly used as a base layer for nickel plating.


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